尘土进入手机模拟测试方法

北京邮电大学学报 ›› 2010, Vol. 33 ›› Issue (3): 112-116.doi: 10.13190/jbupt.201003.112.wangd

王东，许良军，殷铸灵，张灏，朱萌

WANG Dong,XU Liang-jun,YIN Zhu-ling,ZHANG Hao,ZHU Meng

(School of Automation, Beijing University of Posts and Telecommunications, Beijing 100876, China)

Received:2009-08-25 Revised:2010-01-11 Online:2010-06-28 Published:2010-05-14

摘要：

针对尘土进入电器机理及实验模拟方法展开研究. 影响尘土进入的因素有外界气流、电器密

封结构、电器的电场、热场及外界动态环境等. 首先,利用有限元建模，分析了电场因素对尘

土进入的影响，通过对实验结果方差的分析,验证了有限元分析结论. 然后，针对动态环境因素

进行了振动模拟实验，研究振动模式与频率影响. 最后，结合前期研究，综合得到影响尘土进入的

主导因素是外界气流、密封结构及动态环境，而电器电场、热场因素可忽略，并依此给出了实

验模拟系统的设计原理图. 

关键词: 尘土进入, 尘土实验, 有限元方法, 方差分析

Abstract:

The normally used dust test could hardly reflect dust ingression in electric/electronic devices. A

new test method are discussed. Many factors such as air flowing, structure densification, electro-

magnetic and thermal characteristic of electronic devices and dynamic environments may affect

the ingression. The electro-magnetic model of finite element method is established for the evaluation the

electric effects on dust ingression. Some experiments analysis related to dynamic environment

effects on dust ingression are performed. It is shown that the air flowing, structure densification

and dynamic environment effects are the leading factors, thermal and electro effects can be ignored.

Finally, an improved test method is presented. 

Key words: dust ingression, dust test, finite element method, variance analysis

王东，许良军，殷铸灵，张灏，朱萌. 尘土进入手机模拟测试方法[J]. 北京邮电大学学报, 2010, 33(3): 112-116.

WANG Dong,XU Liang-jun,YIN Zhu-ling,ZHANG Hao,ZHU Meng.

Simulation Test of Mobile Phone Dust Ingression [J]. JOURNAL OF BEIJING UNIVERSITY OF POSTS AND TELECOM, 2010, 33(3): 112-116.

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